With the continuous improvement of the performance of electronic equipment, the heat dissipation problem has become one of the key factors restricting its development.
In recent years, the application innovation of aluminum mesh in the field of electronic equipment heat dissipation provides a new idea to solve this problem.
In the research and development laboratory of the existing advanced electronic product manufacturing enterprises, researchers have successfully developed a new type of electronic equipment cooling aluminum mesh by optimizing the structure and material of the aluminum mesh. This aluminum mesh has a unique three-dimensional structure, which greatly increases the heat dissipation area and improves the heat dissipation efficiency. At the same time, the material of the aluminum mesh is specially treated and has good thermal conductivity, which can quickly conduct the heat generated by the electronic equipment.
According to the test, the electronic equipment using this new aluminum mesh as a heat dissipation material, its internal temperature is reduced by about [X]℃ compared with the traditional heat dissipation method, effectively ensuring the stable operation of the electronic equipment and extending the service life of the equipment.
Structural design innovation
Three-dimensional aluminum mesh structure: The traditional aluminum mesh is usually a flat structure, and now the developed three-dimensional aluminum mesh, through a special weaving or molding process, so that it forms a multi-level, multi-angle heat dissipation structure in the space. This structure can increase the heat dissipation area, and can better guide the air flow, so that the heat is dissipated more quickly, which is suitable for high-performance servers, large communication base stations and other equipment with high heat dissipation requirements.
Liquid cooled aluminum mesh: Small flow channels are designed inside the aluminum mesh to carry away heat through the circulating coolant. This liquid cooled aluminum mesh can be integrated with the liquid cooling system of electronic devices to achieve more efficient heat dissipation. For example, in the server of the data center, the liquid-cooled aluminum mesh can be directly installed on the heating parts such as the CPU, and the heat can be quickly transferred to the coolant, avoiding the limitations of traditional air-cooled heat dissipation and greatly improving the heat dissipation efficiency.
Phase change material and aluminum mesh combination: Phase change material is filled in the pores of aluminum mesh or attached to the surface of aluminum mesh. When the temperature of the electronic device rises to the melting point of the phase change material, the phase change material will undergo phase change and absorb a large amount of heat, thus achieving active heat dissipation. This innovative heat dissipation mechanism can effectively control the temperature rise in a timely manner when the equipment generates a large amount of heat in a short period of time.
Integration and multi-functional innovation
Aluminum mesh and circuit integration: The aluminum mesh is directly integrated into the circuit board of the electronic device, as part of the circuit board, it can play the role of supporting and fixing the electronic components, and can realize the heat dissipation function. This integrated design can reduce the volume and weight of heat dissipation components, improve the integration and reliability of electronic equipment, and is widely used in miniaturized and high-performance electronic equipment such as mobile phones and drones.
Multifunctional aluminum mesh module: Developed with a variety of functions of aluminum mesh module, such as aluminum mesh with electromagnetic shielding, shock absorption and other functions combined. In some complex electronic equipment, it is necessary to solve the problem of heat dissipation, but also to prevent electromagnetic interference and reduce the impact of vibration on the equipment. Multifunctional aluminum mesh modules can meet these needs at the same time, providing a more convenient solution for the design and manufacture of electronic equipment, which is suitable for high-end electronic equipment in aerospace, military and other fields.